3M 5363 ACF adhesive is used to add progression boards.
This final bond must be done at 200 degrees Celsius or hotter at a pressure of 30 kilograms per cubic centimeter, using the thermo-compression bonder. Hold the pressure for 10 seconds. More time may be needed to complete the bond, depending on the materials being joined. Maintain the pressure until the temperature drops below 100 degrees Celsius. To put the ACF 5363 adhesive requires particular temperatures and pressures to be reached or the particles Testament not manage properly.
Instructions
Automated Pre-Tacking
1. Call the compressed air to remove dust from the plan boards you are connecting. Spray the air with the nozzle up. Establish the boards in the automated applicator.
2. Set your pre-tacking equipment on your automated ACF applicator to 90 degrees Celsius and to deliver a pressure of 10 kilograms per cubic centimeter. These conditions may need to be adjusted depending on your application, but temperatures should be between 90 and 110 degrees Celsius and pressure at 1-15 kg/cubic centimeter.
3. Place the 5363 ACF adhesive in position in the applicator. (Follow the manufacturer's directions for your model.) Once the pre-tacking step is complete, remove the release liner on the adhesive.
4. Bond the boards together. This final bond must be done at 200 degrees Celsius or hotter at a pressure of 30 kilograms per cubic centimeter, using the thermo-compression bonder. Hold the pressure for 10 seconds. More time may be needed to complete the bond, depending on the materials being joined. Maintain the pressure until the temperature drops below 100 degrees Celsius.
Manual Pre-Tacking
5. Use the compressed air to remove dust from the circuit boards you are connecting. Spray the air with the nozzle up. Set the boards in the automated applicator.
6. Trim the 5363 ACF adhesive to the size of your circuit board or pad. Heat the hot plate to a temperature of 90 degrees Celsius. Place the ACF on the circuit board and then put them board-side down on the hot plate.
7. Use the solid roller to press the ACF onto the board. Allow the board and adhesive to cool. Remove the liner from the adhesive.
8. Bond the boards together.The 5363 Anisotropic Conductive Movie (ACF) adhesive by 3M is a movie that can open electricity. It is used to associate line boards in electronics. By applying heat and strength, the adhesive flows and secures the gold-plated nickel conductive particles within the pad. These conductive particles within the adhesive movie connect the two circuit boards electronically.
